Advances in Laser Materials Processing open site

Date: 2018
Advances in Laser Materials Processing

This chapter covers recent research and development advances in laser-aided direct machining of wafer materials utilized in the electronics industry, primarily semiconductors such as silicon and gallium arsenide. In order to satisfy the steadily growing demand for smaller, faster, and more efficient consumer electronic devices, new fabrication methodologies involving novel laser sources and advanced laser-matter interaction regimes are needed. Successful development of these methods relies on a fundamental understanding of the optical properties of materials and materials' response to irradiation. Laser processing of semiconductor wafers in 2D and 3D is presented utilizing high-energy ultrafast lasers, as well as novel fiber lasers operating in the mid-infrared spectral range.